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EM MICROELECTRONIC - MARIN SA
EM4006
13.56 MHz 64 Data bit Read Only Contactless Identification Device
Description
The EM4006 (previously named H4006) is a CMOS integrated circuit intended for use in electronic Read Only transponders. The exited coil connected to the device generates the power supply via a rectifier and an integrated decoupling capacitor. The clock used for the logic is also extracted from the coil. The logic is mainly composed by a miller code generator and the LROM control. The memory is factory programmed so that each IC is unique.
Features
Operating frequency range 10 MHz to 15 MHz RF interface optimized for 13.56 MHz operation Laser programmed memory array (64 data bit + 16 CRC bit) Modulator switch designed to preserve supply voltage Miller coding Default data rate is 26484 Baud Other data rates possible (mask programmable) On chip rectifier On chip resonant capacitor On chip supply buffer capacitor
Applications
Logistics automation Anticounterfeiting Access control Industrial transponder
Typical Operating Configuration
Pad Assignment
TESTn
TOUT
Coil1 EM4006 Coil2
L: typical 1.4H for fo = 13.56MHz
VSS
EM4006
C1
Fig. 1
C2
Fig. 2
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VDD
EM4006
Absolute Maximum Ratings
Parameter Maximum DC Current forced on COIL1 and COIL2 Power Supply Storage Temp. Die form Storage Temp. PCB form Electrostatic discharge maximum to MIL-STD-883C method 3015 Symbol Conditions
Handling Procedures
ICMAX VDD Tst Tst VESD 30mA -0.3V to 7.5V -55 to +200C -55 to +125C 2000V This device has built-in protection against high static voltages or electric fields; however, anti-static precautions must be taken as for any other CMOS component. Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the voltage range. Unused inputs must always be tied to a defined logic voltage level.
Operating Conditions
Parameter Operating Temp. Symb Top Min -40 Typ Max Units +85 C
Stresses above these listed maximum ratings may cause permanent damages to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction.
Maximum Coil Current AC Voltage on Coil Supply Frequency
Icoil
-10
10
mA
Vcoil fcoil
3 10
14*
13.56
Vpp 15 MHz
*) The AC Voltage on Coil is limited by the on chip voltage limitation circuitry. This is according to the parameter Icoil.
System Principle
Tranceiver Transponder Coil1 Oscillator Antenna Driver EM4006 Coil2 Filter and Gain Demodulator
Data decoder
Data received from transponder
Signal on coils
Transponder coil
Transeiver coil
RF Carrier
Data
Fig. 3
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EM4006
Electrical Characteristics VDD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (VDD - VSS)/2, Ta = 25C unless otherwise specified Parameter Symbol Test Conditions Min. Typ. Max.
Supply Voltage Supply current Rectifier Voltage Drop VDD IDD VREC VON1 VON2 VR VR - VMIN CRES RS Csup Vcoil=100mVRMS f=10kHz IC1C2 = 1mA, modulator switch on VREC = (VC1-VC2) - (VDD - VSS) IVDD VSS = 1mA IVDD VSS = 10mA 1.9 2.4 1.2 0.1 92.6 2.3 2.8 1.4 0.25 94.5 3 140 1.9 60
(note 1)
Units
V A V
150 1.8
Modulator ON DC voltage drop (note 2) Power on reset (note 3)
2.8 3.3 1.7 0.5 96.4
V V V V pF
Coil1 - Coil2 Capacitance Series resistance of CRES Power Supply Capacitor
pF
Note 1: Maximum voltage is defined by forcing 10 mA on C1 - C2 Note 2: Measured between VDD and VSS Note 3: According to Figure 7
Block Diagram
Clock extractor Divider Chain Sequencer Miller Code Generator
C1
CRES
AC1
+
VDD
CSUP
HF Rectifier
AC2 -
Modulator VSS Power Management
Power on Reset
LASER ROM
C2
Fig. 4
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EM4006
General Description
The transponder will be activated when illuminated by a RF field of sufficient power and at any frequency that is compatible with its associated antenna and its internal power supply circuit input characteristics. The chip will Power-on-Reset itself when powered by this incoming energy that exceeds its reset threshold. After resetting itself the chip will start to transmit its memory contents as a stream of Miller code. The memory contents is transmitted by modifying the antenna matching impedance at its internal clock rate, thereby causing varying amounts of RF energy to be reflected from the antenna. This impedance variation will be achieved by connecting a modulating device across the antenna terminals. When switched on the modulating device will present a low impedance to the antenna. This will cause a change in the matching of the antenna and therefore in the amount of RF energy reflected by the transponder to the reader. This reflected signal combines with the transmitted signal in the receiver to yield an amplitude modulated signal representative of the IC memory contents. The "ON" impedance of the modulating device needs to be comparable to about 100 Ohms to affect the matching of the antenna and therefore its reflectivity. The RF signal received from the transponder antenna will serve several purposes : * power the chip * provide a global reset to the chip through its POR (Power-On-Reset) function * provide a carrier for the data transmission * provide the input of the internal clock generation circuit (frequency division)
Functional Description
Output Sequence Transmission from the transponder will be accomplished through variation of the antenna load impedance by switching the modulating device ON and OFF. Output sequence is composed of cycles which are repeated. Each cycle is composed of 82 bits Standard Message Structure (STDMS) which is Miller coded and a pause (LW) during which the modulating device is OFF (see figure 6 for details of Miller code). The pause (LW) is 9bits length. The 82 bit STDMS consists of 1 start bit, 64 data bits, 16 CRC bits and 1 stop bit.
Start bit (1)
Data(64)
CRC (16) Stop bit (1) LW(9)
Memory organisation As already mentioned above the 82 bits are stored in laser programmed ROM (LROM). The 82 bits of this LROM is partioned as followed (see Memory Map):
Factory reserved IC name Customer ID ID code CRC-CCITT Start and stop bits
9 bits 10 bits 13 bits 32 bits 16 bits 2 bits
Memory Map (First out) 0 1 Start 17
2
3
4 5 6 Factory reserved 22
7
8
9
10 11 MSB
12
13 14 IC Name 29 30
15
16
18
19 20 21 LSB MSB 35 36 37
23
24
25 26 27 Customer ID 41 42 ID code 58 43
28
31
32 LSB 48
33 34 MSB 49 50
38
39
40
44
45
46
47
51
52
53
54
55
56 57 ID code
59
60
61
62
63
64 LSB 80 81 MSB Stop
65 LSB
66
67
68
69
70
71
72 73 74 CRC - CCITT
75
76
77
78
79
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EM4006
Factory reserved bits These 9 bits are reserved. Default value is 00Bhex. IC name bits They contains the 3 last characters device name. For this device, the value is 006hex. Customer ID bits This field contains a code which is defined by EM Microelectronic-Marin S.A. For standard version, the code is 0001hex. ID code bits This field is programmed from a counter in that way that each device is unique. Cyclic redundancy check The shift register is reset to all zero with each Stop Bit. CRC code is calculated on 64 data bits. The CRC code is calculated according to CCITT / ISO 3309 - 1984 standards. See figure 5 for principle block schematic and generating polynomial of the CRC code. Start and stop bits Start bit is set to logic 1 and stop bit is set to logic 0.
CRC Block Diagram
SERIAL QUOTIENT
X5
X12
FEEDBACK BEFORE SHIFT
X16
15 14 13 12 11 MSB
10
9
8
7
6
5
4
3
2
1
0 LSB
BCC REGISTER
x
= BCC(Block Check Characters) REGISTER STAGE data input = EXCLUSIVE - OR
CRC-CCITT GENERATING POLYNOMIAL = X16 + X12 + X5 + X0
Fig. 5
RF Interface Resonant capacitor, Rectifier, Limiter and Modulator Switch form the unit which is interfacing to the incoming RF signal. These blocks are interdependent so they are developed as unit. They interface to the antenna which typical characteristics are: LS 1400 nH RS 3 Ohms 30 < Q < 40 at 13.56 MHz.
Resonant Capacitor The capacitor value is adjusted by laser fusing. It can be trimmed by 1pF steps to achieve the absolute value of 94.5pF typically. This option, which is available on request, allows a smaller capacitor tolerance over the whole production. Rectifier and Limiter A full wave rectifier (Graetz Bridge) is used to provide supply voltage to the IC. The reverse breakdown of the diodes is also used to protect the IC from overvoltages.
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EM4006
Modulator Switch Due to the low impedance of the antenna and resonant capacitor the Modulator Switch has to present low RF impedance when switched ON (about 100 ohms). The minimum time period with the Modulator Switch ON is 38 s. At lower data rates this time is even much longer. The current consumption of divider chain running at 13 MHz is near 60 A. Putting together this two figures it is clear that it is not possible to supply the IC during the time the Modulator Switch is ON from the integrated Supply Buffer Capacitor which value is approximately 140 pF. The IC has to get power from the RF field also during the time the Modulator Switch is ON.
This problem is solved by putting the Modulator Switch on the output of the Rectifier (between VDD and VSS) and regulating its ON resistance in function of supply voltage. When the supply voltage is high the ON impedance is low. When the supply voltage drops near the region where the operation of the IC at 13.56 MHz is not guaranteed the ON impedance is increased in order to prevent further drop.
1
0
1
1
0
0
0
1
1
0
1
NRZ-L STREAM
DM-M CODED
Bit i-1 x 0 1
Bit i 1 0 0
no transition at the beginning of Bit i, transition at the beginning of Bit i, no transition at the beginning of Bit i,
transition in the middle of Bit i no transition in the middle of Bit i no transition in the middle of Bit i
Fig. 6
Power Supply Management For a correct operation, the device must be initialised. When the transponder is put in the RF field, the supply voltage increases until it achieves Vr limit (see Figure 7). During this time and for an additionnal 64 bit period, the modulator switch is on and the device initialises its internal logic.
At this point, the data transmission starts and runs while the supply voltage is higher than Vmin. If the supply voltage decreases under this limit, the device is again in an initialising state and the modulator is on.
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EM4006
supply voltage VDD chip operating voltage range: from Vmin to Vmax
Vmax (voltage clipping)
chip supply voltage
Vr (Read wake up) Vmin
time modulator ON/OFF ON
64 bits period
READ
OFF time
Fig. 7
Miller Encoder The input to Miller encoder is NRZ data coming from LROM. The output is coded according to Miller format and is driving the modulator Switch. See figure 6 for example of Miller code. Clock Generation The clock of the logic is extracted from the RF signal. The clock extracted from RF signal is driving the divider chain consisting of toggle flip-flops. The output of this divider chain is data clock with which the data from Laser ROM (LROM) is addressed, encoded and sent to Modulator Switch. The layout of divider chain is designed in a way that different data rates can be chosen with metal mask (options). The following division factors are possible on request: 128, 256, 1024, 2048, 4094 and 8192. The standard is 512.
Others As mentioned in Output Sequence, during the pause (LW) the Modulator Switch is OFF. When observing the pause duration one has to remember that the time with Modulator Switch OFF effectively observed can vary due to different terminations of STDMS. The stop bit at 0 can be represented either by Modulator Switch ON or OFF depending on the data. The start bit at 1 adds 1/2 of data period OFF (transition in the middle of bit period). Figure below show the four possible terminations of STDMS and its influence on entire period passed by Modulator Switch OFF. Level LOW represents Modulator Switch OFF. LDB stands for last data bit.
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EM4006
LDB
1 1 0 0
Last data bit Stop bit at 0 Pause 8 +1 bit periods This transition is not due to Miller encoding.
Fig. 8
Start bit at 1
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EM4006
Pad Description
Name C2 C1 VDD Tout TESTn VSS Description connection to antenna connection to antenna positive supply test output test input with pull up negative supply
Package Information
CID Package
FRONT VIEW
PCB Package
Y Z
J
K
TOP VIEW B
D
MARKING AREA
A R e C2 C1
SYMBOL A B D e F g J K R
MIN 8.2 3.8 5.8 0.38 1.25 0.3 0.42 0.115 0.4
TYP 8.5 4.0 6.0 0.5 1.3 0.4 0.44 0.127 0.5
MAX 8.8 4.2 6.2 0.62 1.35 0.5 0.46 0.139 0.6
X
Dimensions are in mm
C2
C1
MAX
F g
F
SYMBOL MIN TYP X 8.0 Y 4.0 Z Dimensions are in mm
1.0
Fig. 9
Fig. 10
Pad position
14
325 513 772 1144
1124 1600
EM4006
316
152
740
Y
1041
X C1, C2 pad size : 95 X 95 Other pads size : 76 X 76 All dimensions in m
Fig. 11 Copyright 2001, EM Microelectronic-Marin SA 9 www.emmicroelectronic.com
EM4006
Ordering Information Die Form
This chart shows general offering; for detailed Part Number to order, please see the table "Standard Versions" below. EM4006 F9 WS 11
Version: F9 = Miller, 512 clocks per bit Die form: WW = Wafer WS = Sawn Wafer/Frame WT = Sticky Tape WP = Waffle Pack (note 1)
- %%%
Customer Version: %%% = only for custom specific version Bumping: " " (blank) = no bumps E = with Gold Bumps Thickness: 7 = 7 mils (178um) 11 = 11 mils (280um) 21 = 21 mils (533um)
Packaged Devices
This chart shows general offering; for detailed Part Number to order, please see the table "Standard Versions" below. EM4006 F9 CI2L C - %%%
Version: F9 = Miller, 512 clocks per bit Package: CI2L = CID Pack, 2 pins (length 2.5mm) CB2R = PCB Package, 2 pins Customer Version: %%% = only for custom specific version Delivery Form: B = Tape C = Bulk
Remarks: * For ordering please use table of "Standard Version" table below. * For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or packages, please contact EM Microelectronic-Marin S.A. * Note 1: This is a non-standard package. Please contact EM Microelectronic-Marin S.A for availability.
Standard Versions:
The versions below are considered standards and should be readily available. For other versions or other delivery form, please contact EM Microelectronic-Marin S.A. Please make sure to give complete part number when ordering (without space between letters).
Part Number Bit Cycle/ coding bit Miller Miller Miller Miller 512 512 512 512 Package/Die Form Delivery Form / Bumping bulk bulk no bumps custom
For EM internal use only old version OPS#
EM4006 F9 CB2RC EM4006 F9 CI2LC EM4006 F9 WP7 EM4006 F9 YYY-%%%
PCB Package, 2 pins CID package, 2 pins (length 2.5mm) Die in waffle pack, 7 mils custom
501 501 501 %%%
2878 2930 3669
Product Support
Check our Web Site under Products/RF Identification section. Questions can be sent to cid@emmicroelectronic.com
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version.
(c) EM Microelectronic-Marin SA, 01/02, Rev. C/404 Copyright 2001, EM Microelectronic-Marin SA 10 www.emmicroelectronic.com

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